专业物性查询
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总体
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材料状态
已商用：当前有效
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资料 1
Technical Datasheet
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搜索 UL 黄卡
陶氏塑料
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供货地区
北美洲
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用途
Medium Voltage Semiconductive Shield Semiconductive Shield ;地下电缆 ;电缆护罩 ;电线电缆应用
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机构评级
AEIC CS8
ICEA S-93-639
ICEA S-94-649
ICEA S-97-682
IEC 60502
NEMA WC-74
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形式
粒子
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物理性能
额定值
单位制
测试方法
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密度 / 比重
g/cm³
ASTM D792
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抗环境应力开裂 (100% Igepal, F0)
hour
ASTM D1693
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机械性能
额定值
单位制
测试方法
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抗张强度
MPa
ASTM D638
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伸长率 (断裂)
%
ASTM D638
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热性能
额定值
单位制
测试方法
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脆化温度
℃
ASTM D746
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电气性能
额定值
单位制
测试方法
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体积电阻率
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90°C
ohms·cm
ASTM D991
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23°C
ohms·cm
ASTM D991
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130°C
ohms·cm
ASTM D991
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老化
额定值
单位制
测试方法
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拉伸强度保持率 -
1 week
(150°C)
%
ASTM D638
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伸长保持率 -
1 week
(150°C)
%
ASTM D638
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挤出
额定值
单位制
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干燥温度
℃
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干燥时间
hour
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熔体温度
℃
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挤压说明
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DOW ENDURANCE™ HFDA-0802 BK EC provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, use melt extrusion temperatures in the suggested range of 250 to 285°F (121 to 140°C) to avoid pre-cure or scorch. Extruder barrel settings of 110°C (230°F) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDA-0802 BK EC. Specific machine settings will depend on the extruder design and must be established through conventional practices.Dehumidified air hopper drying at 140-160°F (60-70°C) for up to six hours may be employed to remove residual moisture prior to extrusion. Drying is not necessary for DOW ENDURANCE™ HFDA-0802 BK EC due to the lower moisture absorption characteristics relative to conventional semiconductive products.
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补充信息
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Nominal property values above represent tests on molded, stress-relieved slabs. Cure times were 15 minutes at 175°C.Extra-Clean Requirements
Among many desirable characteristics, DOW ENDURANCE™ HFDA-0802 BK EC is extra-clean. DOW ENDURANCE™ HFDA-0802 BK EC typically has less than 0.005% sulfur and less than 0.01% ash. The raw materials used for DOW ENDURANCE™ HFDA-0802 BK EC are cleaner by design than those used for conventional semiconductive materials. Additional precautions are employed during the manufacture of DOW ENDURANCE™ HFDA-0802 BK EC relative to conventional conductor shields to prevent introduction of any contamination to the raw materials and to the final product. These low levels of contamination can be expected to play a positive role in the manufacture of a totally extra-clean cable.
Supersmooth Extruded Surface
DOW ENDURANCE™ HFDA-0802 BK EC meets strict standards of smoothness established for a crosslinkable semiconductive shield compound. The extruded surface of DOW ENDURANCE™ HFDA-0802 BK EC must meet a smoothness specification that is more rigorous that conventional semiconductive shields. Throughout the production process, the product is tested to ensure smoothness. Extruded tapes are scanned by an automatic inspection system in a clean room. The tape smoothness data is managed using an acceptance sampling plan, which ensures that the shipping container meets or exceeds the product's smoothness standard. The DOW ENDURANCE™ HFDA-0802 BK EC smoothness standard has been designed to meet the global industry specifications for semiconductive shield materials on medium and high voltage cables.
Each batch of DOW ENDURANCE™ HFDA-0802 BK EC meets the following smoothness requirement:
Protrusion Height / Maximum Allowable
60-74 µm / 0 per m²
>75 µm / 0 per m²
Storage
The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product.
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备注
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1通过这些链接您能够访问供应商资料。我们尽量保证及时更新资料；不过您可以从供应商处了解最新资料。
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ANSI/UL 94 小规模测试数据与建筑材料、家具和有关内容不相关。ANSI/UL 94 小规模测试数据仅用于确定成品设备和装置的组件和部件中所用塑料材料的易燃性，其中组合的可接受性由 UL 确定。
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